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(IndustryNews247.Com, February 17, 2018 ) According to the new market research report "Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022", the flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.
Browse 66 market data tables and 71 figures spread through 157 pages and in-depth TOC on “Flip Chip Technology Market - Global Forecast to 2022 <||>rnhttps://www.marketsandmarkets.com/Market-Reports/flip-chip-technology-market-264572064.html
On the basis of packaging technology, the flip chip technology market is segmented into 2D IC, 2.5D IC, and 3D IC packaging technology. With the semiconductor technology moving towards integration of diverse chips, 2.5D IC packaging technology and 3D IC packaging technology are becoming the mainstream trend in obtaining the integration objectives. Owing to the growing demand for increasing density, higher bandwidth, and lower power, design teams are expected to adopt 3D ICs with TSVs, which promise ‘more than Moore’ integration by packaging a great deal of functionality into small form factors, while improving performance and reducing costs.
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Smartphones & tablets are observed to have the highest adoption among all the consumer electronic devices, owing to their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. The automotive market is expected to grow at a second-highest CAGR rate, catapulting the flip chip technology market further.
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